This year coincides with Apple’s 10th year of launching a new iPhone, which is expected by the market. Taiwan’s printed circuit board manufacturers are aggressively vying for the new carrier-like substrate manufacturing process. If it fails, the Japanese manufacturers will take it all.
Apple’s new iPhone printed circuit board (PCB) process is almost determined to be upgraded from any layer (AnyLayer) high-density connection (HDI) board to substtrate-like board (substtrate-like), industry revealed that it will adopt the analog semi-additive method Manufacturing process (MSAP), following the previous report that 6 sparrow screens were selected, and now Ibiden, a Japanese PCB manufacturer, may be added.
Regardless of whether there are 6 or 7 companies, Taiwan-based companies account for the most 4 companies. In addition to the original supply chain Huatong Computer (2313), Xinxing Electronics (3037) and Zhending-KY (4958), Jingshuo Technology (3189) is added. The two are TTM and AT&S.
Tai Optoelectronics has dominated the global high-end smartphone market with halogen-free copper clad substrates (CCL) in recent years, and Apple is no exception. Hitachi has two Japanese CCLs, and Panasonic has the majority.
Apple’s PCB supply chain points out that although Tai Optoelectronics is actively trying to get out this year, everyone is currently working hard to improve the MSAP yield rate and win orders. They can only use high-reliability raw materials. They have no time and dare not try Tai Optoelectronics. CCL.
Taiwan Optoelectronics has recently emphasized that Apple only accounts for 10% of the order, and has been actively competing for cloud, automotive and other application products. , Increase cloud application products to drive profits in the next 3 years, and the target price is 155 yuan.
Article source: Business Times
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