Liquid metal is a material with much higher thermal conductivity than silicone grease. In the early days, this material was only used as a special material for personal DIY. With the increase of chip power consumption and operating frequency, some Intel-branded notebook products are shipped Comes with liquid metal to suppress the CPU that generates huge heat. Recently, a patent registered by Sony Interactive Entertainment was published, which seems to reveal that the PS5 host may use liquid metal as the thermal conductive material . The new patent of
shows that this chip should be passively dissipating heat, and liquid metal is used as the thermal conductive material. 31 in the figure is the liquid metal layer. Since liquid metal has the ability to conduct electricity, in order to prevent the liquid metal from short-circuiting the circuit board, a liquid gold isolation material is also designed around the chip, of which 33 is a circle of ultraviolet curing resin that isolates the liquid metal.
The PS5 chip is manufactured using TSMC’s 7nm process. The GPU has a maximum frequency of 2.23GHz, and the CPU has a maximum of 3.5GHz. With such a high frequency, the heat generation should not be underestimated.
. At present, the AMD processor , which also uses the 7nm process, has a heat accumulation problem due to the high chip density. Coupled with the high operating frequency of the PS5, the traditional silicone grease may not meet the high frequency operation of the chip. Heat dissipation needs, therefore, it is possible to choose liquid metal with higher thermal conductivity as the thermal conductive material, and Sony’s patent may also be applied to the PS5 game console.
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