Hey, I thought that after so many years of trouble, mobile phone manufacturers were almost at the end of their trouble. Unexpectedly, in order to compete for the ever-tightening Red Sea market, various manufacturers are now experiencing an intensifying trend. Regardless of the fe

Hey, I thought that after so many years of trouble, mobile phone manufacturers were almost at the end of their trouble.

Unexpectedly, in order to compete for the ever-tightening Red Sea market, various manufacturers are now having an intensifying trend.

Regardless of the feat of the two chip manufacturers rushing to release flagship chips, just look at this past October, there were actually nearly ten models equipped with Dimensity 9400/Snapdragon 8 Extreme Edition released. The performance of these flagship products is not They are almost equal, but at the same time each has its own characteristics. It can be called a fight between gods.

(Source: Xiaomi)

This is not over yet. Manufacturers such as Realme, Redmi, Red Devils, and ROG are already gearing up to show off their ambitions in November. Some focus on true full screens, and some focus on full screens. rgb esports, No matter whether you focus on ultimate cost-effectiveness, quality or a balanced bucket, there is always a product that suits you.

But having said that, I wonder if you have noticed one thing -

The new products released during this period are basically flagship mobile phones with a price range of over 3,000 yuan.

These flagship machines have great configuration and performance, but the price is not very friendly to students.

Compared with the sub-flagship with comprehensively improved performance and texture, contemporary college students who neither like taking pictures nor have any sense of materials may want to know when the cost-effective killers that manufacturers hold in their hands will be launched. When will the mid-range smartphone receive an iterative update?

Don’t worry, Fa Ge has a new move here.

(Source: Weibo)

According to the blogger Digital Chat Station, MediaTek will launch the Dimensity 8400 mobile platform this month. The chip uses TSMC’s 4nm process technology and will be launched for the first time. The cortex-a725 is a full-core architecture and currently has manufacturers In active testing, the product will be officially released this month.

Good guys, MediaTek has also started to implement seamless connection?

Dimensity 8400 will have the flagship architecture

But don’t tell me, after looking through relevant reports about Dimensity 8400, I found that this chip seems to be really something.

Let’s take the most basic product architecture as an example.

You must know the product architecture of the Dimensity 8000 series. There has always been a generation gap between the Dimensity 9000 series. The previously released Dimensity 8300 can use 1*a715 super large core + 3*a715 large core + 4*a520 The small-core architecture is considered a leap forward when placed in the mid-range product line.

This year’s iteration of Dimensity 8400 is expected to be the same as Dimensity 9400, directly adopting the full-core architecture.

(Source: Weibo)

Of course, as a sub-flagship/mid-range mobile platform, it is still a bit unrealistic to directly use the cortex-x925/cortex-x4 ultra-large core.

is replaced by the unprecedented a725 full-core architecture, which is composed of 1*3.35ghz a725 core + 3*3.20ghz a725 core + 4*2.4ghz a725 core. It completely abandons the a5xx series small core with lagging energy efficiency and performance. There is a significant improvement.

gpu, the Dimensity 8400 mobile platform is expected to use the new immortalis-g925, which is the same GPU IP as the Dimensity 9400, but the number of cores may be reduced to 6-8, and the operation will be improved to a certain extent. frequency to improve gaming performance.

(Source: arm)

Good guy, this specification can almost be said to be the "Youth Edition" Dimensity 9400.

The flagship architecture of the same family and the relatively lower core frequency allowed the Dimensity 8400 to achieve a comprehensive score of about 1.7 million points to 1.8 million points in AnTuTu.

For comparison, the widely publicized running scores of Snapdragon 8 gen2/Snapdragon 8s gen3 are basically at this level.

Taking into account the progress in process technology and the weakening of extreme performance, it is expected that the performance of this mid-range chip may be even better in terms of energy efficiency ratio.

Compared with the "Youth Edition" Dimensity 9400, perhaps it is more appropriate to call it the "Energy Saving Edition" Dimensity 9400.

Which mobile phone will win the first launch of Dimensity 8400?

Of course, for everyone, the news about the chip is just a picture. The most important thing is when the product will be launched.

Judging from the current revelations, the manufacturer that will win the first launch of Dimensity 8400 this year is most likely the familiar redmi.

Especially redmi, the redmi k70e released last year was first equipped with Dimensity 8300-ultra, which was the most powerful mid-range mobile phone at the time; and the redmi k70 extreme version released in the middle of this year relied on Dimensity 9400 +’s excellent tuning has been dubbed the title of “the smoothest Xiaomi flagship phone” .

(Source: redmi)

’s excellent tuning of Dimensity and its balanced product quality make people appreciate the redmi k80e/redmi turbo 4 is even more exciting.

screen, considering that the extremely narrow four-sided straight screen of redmi k70e is well received, it is expected that redmi k80e/redmi turbo 4 will continue to use Huaxing Optoelectronics 1.5k screen. Although the resolution/refresh rate remains unchanged, the screen brightness, high frequency The dimming and other parameters should be in line with mainstream flagships, the ltps refresh method is also more eye-friendly, and the quality should be top-notch in the same price range.

(Source: redmi)

In terms of texture, I blindly guess that redmi will give a glass cover this time, but maintain the plastic middle frame design.

Judging from user feedback, the structural rigidity of redmi turbo 3 is indeed somewhat insufficient. The glass cover can not only improve the feeling of holding, but also give a certain blessing in terms of texture. It is very good to achieve a level similar to redmi k70e .

In order to keep up with the great improvements in battery life of competitors, the battery of redmi turbo 4 is expected to reach 6000mah this time, and the charging will be upgraded to the same level of 90w fast charging as k70e, which can be regarded as keeping up with the average charging level of many flagship machines this year. .

As for the images that don’t attract much attention at this price...

The high probability is still the combination of 50mp lyt-600 main camera + 8mp super wide-angle + 2mp macro. At most, it can only make some simple improvements in the algorithm. What's wrong with

? It's not like you can't scan the code, right? In the past three years, MediaTek has become more and more present in the high-end market.

Starting from Dimensity 9000, MediaTek’s flagship chips have been closing the theoretical performance gap with Qualcomm every year, and even achieved a certain overtake on Dimensity 9300. This time, Dimensity 9400 is even more powerful than Qualcomm’s flagship mobile phone The platform was released on the front, and it felt like opening up a new world with blue and black factories.

On the contrary, its coverage at the mid-range level has been somewhat eroded by Qualcomm.

(Source: Qualcomm)

Yes, MediaTek’s performance in the low-end market is still remarkable, and it once broke consumers’ inherent perceptions with the excellent energy efficiency performance of Dimensity 8100/Dimensity 8200. This has virtually put a lot of pressure on Qualcomm.

However, with the blessing of high-end architecture and technology, Qualcomm has made great efforts in Snapdragon 7+ gen2/Snapdragon 7+ gen3 for two consecutive generations. With an AnTuTu score of nearly 1.7 million, it not only faces MediaTek’s previous generation flagship chip but also Not to mention making more concessions, it can be said that it has achieved dimensionality reduction against MediaTek in the mid-to-high-end market.

The failure of Dimensity 8300 series sounded the alarm for MediaTek.

Because of this, we will see the launch of Dimensity 8400. The full large-core design based on TSMC's 4nm can not only improve extreme performance, but also reduce power consumption during daily use. The latest GPU, which has the same origin as the Dimensity 9400, is expected to bring an excellent gaming experience.

The only question now is whether this chip will repeat the same mistakes in the end, and once again there will be a situation where few manufacturers dare to try it?

I really hope not to be the case.