According to news on November 6, as each flagship model is released one after another, the next thing to attract attention is the news related to each sub-flagship. Today, news leaked about the suspected OPPO Reno 13 Pro. According to reports, the new phone is expected to de

News on November 6th, as various flagship models are released one after another, the next thing to attract attention is the news related to each sub-flagship. Today, news has been revealed about the suspected oppo reno 13 pro.

According to reports, the new phone is expected to be launched with the Dimensity 8350 processor. In terms of other configurations, the new phone is expected to use a 6.83-inch customized straight screen with a constant depth of four curves. In terms of imaging, the new phone is expected to use a 50mp outsole main camera on the rear, paired with a 50mp telephoto and an 8mp ultra-wide camera, and a 50mp front camera.

According to previous reports, the oppo reno 13 series is expected to adopt a matrix lens arrangement design in the upper left corner, which will differentiate it from the oppo find x series. As for the specific configuration, sources say that the medium cup may have vertical dual cameras, while the large cup is expected to have three cameras. As for the super large cup, considering that it is difficult to widen the gap with find x, it is not expected to be available.

As for other related configurations, according to the news, oppo reno 13 pro is expected to support 80w wired fast charging and 50w wireless fast charging, and support high-standard dustproof and waterproof, using a metal middle frame. The new phone is tentatively scheduled to be released on November 25th, so it’s worth looking forward to.

In addition to Dimensity 8350, the news also revealed related news about Dimensity 8400. This chip is expected to be launched by Xiaomi . Dimensity 8400 continues the related designs of Dimensity 9400, such as full large-core design and the same arm immortalis-g925 GPU. As for the difference between Dimensity 8350 and Dimensity 8400, we will not know it until they are officially released.

I have to say that the current competition in the mobile phone market is also extremely fierce. Not only are flagship models being released together, but the flagship models have not yet been fully released, and the sub-flagship models have begun to warm up. It can be seen that each company is also competing for the market. Used all his strength. Such a dense release rhythm is more friendly to consumers. If you are not particularly anxious, you can wait until most models are released before choosing a model that is more suitable for you.

News on November 6th, as various flagship models are released one after another, the next thing to attract attention is the news related to each sub-flagship. Today, news has been revealed about the suspected oppo reno 13 pro.

According to reports, the new phone is expected to be launched with the Dimensity 8350 processor. In terms of other configurations, the new phone is expected to use a 6.83-inch customized straight screen with a constant depth of four curves. In terms of imaging, the new phone is expected to use a 50mp outsole main camera on the rear, paired with a 50mp telephoto and an 8mp ultra-wide camera, and a 50mp front camera.

According to previous reports, the oppo reno 13 series is expected to adopt a matrix lens arrangement design in the upper left corner, which will differentiate it from the oppo find x series. As for the specific configuration, sources say that the medium cup may have vertical dual cameras, while the large cup is expected to have three cameras. As for the super large cup, considering that it is difficult to widen the gap with find x, it is not expected to be available.

As for other related configurations, according to the news, oppo reno 13 pro is expected to support 80w wired fast charging and 50w wireless fast charging, and support high-standard dustproof and waterproof, using a metal middle frame. The new phone is tentatively scheduled to be released on November 25th, so it’s worth looking forward to.

In addition to Dimensity 8350, the news also revealed related news about Dimensity 8400. This chip is expected to be launched by Xiaomi . Dimensity 8400 continues the related designs of Dimensity 9400, such as full large-core design and the same arm immortalis-g925 GPU. As for the difference between Dimensity 8350 and Dimensity 8400, we will not know it until they are officially released.

I have to say that the current competition in the mobile phone market is also extremely fierce. Not only are flagship models being released together, but the flagship models have not yet been fully released, and the sub-flagship models have begun to warm up. It can be seen that each company is also competing for the market. Used all his strength. Such a dense release rhythm is more friendly to consumers. If you are not particularly anxious, you can wait until most models are released before choosing a model that is more suitable for you.