"IC manufacturing" TSMC and Intel introduce EUV equipment and material manufacturers to enhance camping activities

Author: DIGITIMES Chen Yujuan

Kadeng Chairman Qiu Mingqian (middle) said that thanks to the order of extreme ultraviolet light mask boxes, and the benefits of deepening the Chinese market, a large order of 12-inch front-loading wafer transfer boxes has been received. Performance picked up in 2018. Photo by DIGITIMES Fu Shimin

Chairman Qiu Mingqian, a major manufacturer of semiconductor equipment and materials, said on the 29th that benefiting from the " made in China 2025" grand strategy, investment in many new 8-inch and 12-inch fabs has strongly driven the expansion of capital expenditures in the semiconductor industry. Coupled with 5G, the mining boom, and the rise of the blockchain, the demand for semiconductors for high-end nanochips is rising. He is optimistic about the continued growth of the semiconductor industry in the future. Jiadeng benefits from the new production capacity of wafer in the 12-inch factory on both sides of the Taiwan Strait. 12-inch Large orders for front-opening wafer pods (300mm FOUP) have been placed in the bag one after another. In addition, the extreme ultraviolet photomask box (EUV POD) has obtained ASML certification, and the volume will gradually increase in the second half of the year. The performance is expected to pick up quarter by quarter, and should be good for the whole year Profitable results have been handed over, and the performance in 2019 is expected to jump.

Jiadeng held a shareholder meeting on the 29th, and Chairman Qiu Mingqian made the above remarks. Gadden, which received Intel Capital in 2009, is mainly engaged in masks, and wafer handling solutions. Currently, mask solutions account for more than 50% of revenue.

In order to improve production efficiency, Gardeng launched the Shugu factory in Taiwan in mid-2017 to integrate production bases and continue to strengthen the layout of customers in the domestic market.

Qiu Mingqian said that the semiconductor industry is a high-capital and high-tech-intensive industry with high barriers to entry and a long time to mature technology. Jiadeng has gone through the reorganization period of new factories and new technology development. Strategically, focus has replaced divergence. Materials, equipment and other related manufacturers in the industry adopt strategic alliances, establish long-term partnerships, and seek high-efficiency cooperation models to meet market expectations for product performance and support speed improvements, strive to improve operational efficiency, carry out industry upstream, midstream and downstream integration, and deepen the Chinese market. Exploring advantages and continuing to extend the old leading position to re-raise the overall gross profit margin.

Qiu Mingqian further pointed out that Gadeng’s main photomask carrier products are currently in a clear situation. The extreme ultraviolet (EUV) lithography technology that has been expected for 10 years has been officially commercialized. It is gradually advancing, and the demand for equipment purchase has been reflected in the order purchase.

9 years ago, Gadeng fully invested in the EUV project. The latest extreme ultraviolet light mask box has been certified by ASML's NXE3400 machine, and is now conducting product certification work with many customers. Although EUV mass production faces many challenges, semiconductor Only EUV technology can break through the bottleneck of the manufacturing process, and has a cost advantage. Therefore, Gardeng continues to be optimistic about the next wave of growth demand for extreme ultraviolet light mask boxes.

It is reported that the main customers of Jiadeng EUV photomask boxes are TSMC, Intel , and other industry players are still negotiating. In terms of wafer carrier products, it cooperates with the "Made in China 2025" policy and cooperates with more than 20 local 12 2.5-inch fab construction plan, Jiadeng's 12-inch front-loading wafer transport box has been certified by the front-end manufacturers, and the actual performance of the rear-end packaging and testing plants has been increased. The visibility of orders in the next few years is quite clear. The market expects that as orders for 12-inch FOUPs are gradually placed in place, a small amount of EUV reticle boxes will also start to be shipped, and the business activity will increase in the second half of the year.